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MediaTek recently announced the launch of its latest mid range chipset, the Helio P70. Realme has revealed that it will be the first company that will introduce a new smartphone series with the latest chipset.
The SoC is manufactured on the same TSMC 12nm FinFET process like its predecessor. The differences from the Helio P60 are most apparent in the clock speeds of the CPU clusters and the clock speed of the GPU. The big Arm Cortex A73 cluster is now clocked at 2.1GHz, while the Arm Cortex A53 cores are clocked at 2.0GHz. The increase in clock speeds is said to result in a 13% performance improvement over its predecessor.
The company has confirmed that the latest smartphone will be launched by the end of this year. The brand will bring an all new series for its users that will be powered by the latest MediaTek Helio P70 chipset.
The upcoming Realme smartphone is going to be the successor to the Realme 2 and Realme 2 Pro, the company might launch the device with a name like Realme 3 Pro or Realme 3. The Helio P70 supports up to 8GB of DDR4X RAM, and as Realme already has its smartphones running with up to 6GB of RAM, it might go a step ahead and equip the next Realme smartphone with 8GB of RAM.
