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Qualcomms latest mobile flagship processor chip appears to be set for unveiling at the companys annual tech summit in Hawaii on December 4th.Instead of calling the upcoming SoC the Snapdragon 855, Qualcomm will instead dub it as Snapdragon 8150. The chip is expected to make its way into the hands of consumers with the release of the Galaxy S10 next year.
The firm just sent out media invites for the event, where it launched the Snapdragon 845 last year. The Qualcomm Snapdragon 8150 is expected to come with three cluster CPU core design, similar to Kirin 980 and Exynos 9820. It will feature one large performance core running at a clock speed of 2.84GHz, three medium cores clocked at 2.4GHz, and four small efficiency cores clocked at 1.78GHz.
Like Huaweis Kirin 980 and Apples A12 Bionic, the Snapdragon 8150 is built on the 7nm FinFET process by TSMC and the die size is going to be 12.4 x 12.4mm. It's also set to feature an Adreno 640 GPU, and overall efficiency will be increased by 20 percent.
The chipset has been spotted on AnTuTu with a score of 362,292 points and is the first chipset powering an Android platform to earn more than 360,000 points. Like the Snapdragon 845, it is likely to show up in the majority of new Android flagships of 2019.
